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this document contains detailed information on power considerations, dc/ac electrical characteristics, and ac timing speci?ations for the .29 m (hip3) devices of the powerquicc ii family of communications processors?he MPC8260 and the mpc8255. throughout this document, the MPC8260 and the mpc8255 are collectively referred to as the MPC8260. the following topics are addressed: topic page section 1.1, ?eatures 2 section 1.2, ?lectrical and thermal characteristics 5 section 1.2.1, ?c electrical characteristics 5 section 1.2.2, ?hermal characteristics 9 section 1.2.3, ?ower considerations 9 section 1.2.4, ac electrical characteristics 10 section 1.3, ?lock con?uration modes 18 section 1.3.1, ?ocal bus mode 18 section 1.4, ?inout 20 section 1.5, ?ackage description 33 section 1.6, ?rdering information 34 note: document revision history changes to this document are summarized in table 17 on page 35. technical data MPC8260ec/d rev. 1.2 8/2003 MPC8260 (hip3) hardw are speci?ations f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
2 MPC8260 (hip3) hardware speci?ations motorola features figure 1 shows the block diagram for the MPC8260. figure 1. MPC8260 block diagram 1.1 features the major features of the MPC8260 are as follows: dual-issue integer core a core version of the ec603e microprocessor system core microprocessor supporting frequencies of 133?00 mhz (150?00 mhz for the mpc8255) separate 16-kbyte data and instruction caches: four-way set associative physically addressed lru replacement algorithm powerpc architecture-compliant memory management unit (mmu) common on-chip processor (cop) test interface high-performance (4.4?.1 spec95 benchmark at 200 mhz; 280 dhrystones mips at 16 kbytes g2 core i-cache i-mmu 16 kbytes d-cache d-mmu communication processor module (cpm) timers parallel i/o baud rate generators 24 kbytes 32-bit risc microcontroller and program rom serial dmas 2 virtual idmas bridge memory controller clock counter system functions system interface unit (siu) local bus 32 bits, up to 66 mhz mcc1 1 mcc2 fcc1 fcc2 fcc3 1 scc1 scc2 scc3 scc4 smc1 smc2 spi i 2 c serial interface 3 mii 2 utopia ports ports 3 60x bus dual-port ram interrupt controller time slot assigner 8 tdm ports 2 non-multiplexed i/o 60x-to-local bus interface unit notes: 1 not on mpc8255 2 4 on the mpc8255 3 2 on the mpc8255 f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
motorola MPC8260 (hip3) hardware speci?ations 3 features 200 mhz) supports bus snooping for data cache coherency floating-point unit (fpu) separate power supply for internal logic and for i/o separate plls for g2 core and for the cpm g2 core and cpm can run at different frequencies for power/performance optimization internal core/bus clock multiplier that provides 1.5:1, 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 5:1, 6:1 ratios internal cpm/bus clock multiplier that provides 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 5:1, 6:1 ratios 64-bit data and 32-bit address 60x bus bus supports multiple master designs supports single- and four-beat burst transfers 64-, 32-, 16-, and 8-bit port sizes controlled by on-chip memory controller supports data parity or ecc and address parity 32-bit data and 18-bit address local bus single-master bus, supports external slaves eight-beat burst transfers 32-, 16-, and 8-bit port sizes controlled by on-chip memory controller system interface unit (siu) clock synthesizer reset controller real-time clock (rtc) register periodic interrupt timer hardware bus monitor and software watchdog timer ieee 1149.1 jtag test access port twelve-bank memory controller glueless interface to sram, page mode sdram, dram, eprom, flash and other user- de?able peripherals byte write enables and selectable parity generation 32-bit address decodes with programmable bank size three user programmable machines, general-purpose chip-select machine, and page-mode pipeline sdram machine byte selects for 64 bus width (60x) and byte selects for 32 bus width (local) dedicated interface logic for sdram cpu core can be disabled and the device can be used in slave mode to an external core communications processor module (cpm) embedded 32-bit communications processor (cp) uses a risc architecture for ?xible support for communications protocols interfaces to g2 core through on-chip 24-kbyte dual-port ram and dma controller serial dma channels for receive and transmit on all serial channels parallel i/o registers with open-drain and interrupt capability f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
4 MPC8260 (hip3) hardware speci?ations motorola features virtual dma functionality executing memory-to-memory and memory-to-i/o transfers three fast communications controllers (two on the mpc8255) supporting the following protocols: 10/100-mbit ethernet/ieee 802.3 cdma/cs interface through media independent interface (mii) atm?ull-duplex sar protocols at 155 mbps, through utopia interface, aal5, aal1, aal0 protocols, tm 4.0 cbr, vbr, ubr, abr traf? types, up to 16 k external connections transparent hdlc?p to t3 rates (clear channel) two multichannel controllers (mccs) (only mcc2 on the mpc8255) each mcc handles 128 serial, full-duplex, 64-kbps data channels. each mcc can be split into four subgroups of 32 channels each. almost any combination of subgroups can be multiplexed to single or multiple tdm interfaces up to four tdm interfaces per mcc four serial communications controllers (sccs) identical to those on the mpc860, supporting the digital portions of the following protocols: ethernet/ieee 802.3 cdma/cs hdlc/sdlc and hdlc bus universal asynchronous receiver transmitter (uart) synchronous uart binary synchronous (bisync) communications transparent two serial management controllers (smcs), identical to those of the mpc860 provide management for bri devices as general circuit interface (gci) controllers in time- division-multiplexed (tdm) channels transparent uart (low-speed operation) one serial peripheral interface identical to the mpc860 spi one inter-integrated circuit (i 2 c) controller (identical to the mpc860 i 2 c controller) microwire compatible multiple-master, single-master, and slave modes up to eight tdm interfaces (4 on the mpc8255) supports two groups of four tdm channels for a total of eight tdms 2,048 bytes of si ram bit or byte resolution independent transmit and receive routing, frame synchronization supports t1, cept, t1/e1, t3/e3, pulse code modulation highway, isdn basic rate, isdn primary rate, motorola interchip digital link (idl), general circuit interface (gci), and user-de?ed tdm serial interfaces eight independent baud rate generators and 20 input clock pins for supplying clocks to fccs, f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
motorola MPC8260 (hip3) hardware speci?ations 5 electrical and thermal characteristics sccs, smcs, and serial channels four independent 16-bit timers that can be interconnected as two 32-bit timers 1.2 electrical and thermal characteristics this section provides ac and dc electrical speci?ations and thermal characteristics for the MPC8260. 1.2.1 dc electrical characteristics this section describes the dc electrical characteristics for the MPC8260. table 1 shows the maximum electrical ratings. table 2 lists recommended operational voltage conditions. note: core, pll, and i/o supply voltages vddh, vccsyn, and vdd must track each other and both must vary in the same direction?n the positive direction (+5% and +0.1 vdc) or in the negative direction (-5% and -0.1 vdc). table 1. absolute maximum ratings 1 1 absolute maximum ratings are stress ratings only; functional operation (see table 2) at the maximums is not guaranteed. stress beyond those listed may affect device reliability or cause permanent damage. rating symbol value unit core supply voltage 2 2 caution: vdd/vccsyn must not exceed vddh by more than 0.4 v at any time, including during power-on reset. vdd -0.3 ?2.75 v pll supply voltage 2 vccsyn -0.3 ?2.75 v i/o supply voltage 3 3 caution: vddh can exceed vdd/vccsyn by 3.3 v during power on reset by no more than 100 msec. vddh should not exceed vdd/vccsyn by more than 2.0 v during normal operation. vddh -0.3 ?4.0 v input voltage 4 4 caution: vin must not exceed vddh by more than 2.5 v at any time, including during power-on reset. vin gnd(-0.3) ?3.6 v junction temperature t j 120 ?c storage temperature range t stg (-55) ?(+150) ?c table 2. recommended operating conditions 1 1 caution: these are the recommended and tested operating conditions. proper device operating outside of these conditions is not guaranteed. rating symbol 2.5-v device 2 2 parts labeled with an ?hva suf? are 2.6-v devices. unit core supply voltage vdd 2.4?.7 v pll supply voltage vccsyn 2.4?.7 v i/o supply voltage vddh 3.135 ?3.465 v input voltage vin gnd (-0.3) ?3.465 v junction temperature (maximum) t j 105 ?c f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
6 MPC8260 (hip3) hardware speci?ations motorola electrical and thermal characteristics this device contains circuitry protecting against damage due to high static voltage or electrical ?lds; however, it is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (either gnd or v cc ). figure 2 shows the undershoot and overshoot voltage of the 60x and local bus memory interface of the mpc8280. note that in pci mode the i/o interface is different. figure 2. overshoot/undershoot voltage table 3 shows dc electrical characteristics. table 3. dc electrical characteristics 1 characteristic symbol min max unit input high voltage, all inputs except clkin v ih 2.0 3.465 v input low voltage v il gnd 0.8 v clkin input high voltage v ihc 2.4 3.465 v clkin input low voltage v ilc gnd 0.4 v input leakage current, v in = vddh 2 i in ?0a hi-z (off state) leakage current, v in = vddh 2 i oz ?0a signal low input current, v il = 0.8 v i l ?a signal high input current, v ih = 2.0 v i h ?a output high voltage, i oh = ? ma except xfc, utopia mode, and open drain pins in utopia mode: i oh = -8.0ma pa[0-31] pb[4-31] pc[0-31] pd[4-31] v oh 2.4 v in utopia mode: i ol = 8.0ma pa[0-31] pb[4-31] pc[0-31] pd[4-31] v ol 0.5 v gnd gnd ?0.3 v gnd ?1.0 v not to exceed 10% gv dd of t sdram_clk gv dd + 5% 4 v v ih v il f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
motorola MPC8260 (hip3) hardware speci?ations 7 electrical and thermal characteristics i ol = 7.0ma br bg abb/irq2 ts a[0-31] tt[0-4] tbst tsize[0?] aa ck ar tr y dbg dbb /irq3 d[0-63] dp(0)/rsr v /ext_br2 dp(1)/irq1 /ext_bg2 dp(2)/tlbisync /irq2 /ext_dbg2 dp(3)/irq3 /ext_br3 /ckstp_out dp(4)/irq4 /ext_bg3 /core_srest dp(5)/tben/irq5 /ext_dbg3 dp(6)/cse(0)/irq6 dp(7)/cse(1)/irq7 psd v al t a tea gbl /irq1 ci/ baddr29/irq2 wt /baddr30/irq3 l2_hit /irq4 cpu_bg/ baddr31/irq5 cpu_dbg cpu_br irq0 /nmi_out irq7 /int_out /ape poreset hreset sreset rstconf qreq v ol 0.4 v table 3. dc electrical characteristics 1 (continued) characteristic symbol min max unit f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
8 MPC8260 (hip3) hardware speci?ations motorola electrical and thermal characteristics i ol = 5.3ma cs [0-9] cs (10)/bctl1 cs (11)/ap(0) baddr[27?8] ale bctl0 pwe (0:7)/psddqm( 0:7)/pbs (0:7) psda10/pgpl0 psd we/ pgpl1 poe/psdras/pgpl2 psdcas/pgpl3 pgta/pupmwait/pgpl4/ppbs psdamux/pgpl5 lwe[0?]lsddqm[0:3]/lbs[0?] lsda10/lgpl0 lsdwe/lgpl1 loe/lsdras/lgpl2 lsdcas/lgpl3 lgta/lupmwait/lgpl4/lpbs lsdamux 3 /lgpl5 l wr modck1/ap(1)/tc(0)/bnksel(0) modck2/ap(2)/tc(1)/bnksel(1) modck3/ap(3)/tc(2)/bnksel(2) i ol = 3.2ma l_a14 l_a15/smi l_a16 l_a17/ckstp_out l_a18 l_a19 l_a20 l_a21 l_a22 l_a23 l_a24 l_a25 l_a26 l_a27 l_a28/core_sreset l_a29 l_a30 l_a31 lcl_d(0-31) lcl_dp(0-3) pa[0?1] pb[4?1] pc[0?1] pd[4?1] tdo v ol 0.4 v 1 the default con?uration of the cpm pins (pa[0?1], pb[4?1], pc[0?1], pd[4?1]) is input. to prevent excessive dc current, it is recommended to either pull unused pins to gnd or vddh, or to con?ure them as outputs. 2 the leakage current is measured for nominal vdd, vccsyn, and vdd. 3 rev c.2 silicon only. table 3. dc electrical characteristics 1 (continued) characteristic symbol min max unit f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
motorola MPC8260 (hip3) hardware speci?ations 9 electrical and thermal characteristics 1.2.2 thermal characteristics table 4 describes thermal characteristics. 1.2.3 power considerations the average chip-junction temperature , t j , in c can be obtained from the following: t j = t a + (p d x ja ) (1) where t a = ambient temperature c ja = package thermal resistance , junction to ambient , c/w p d = p int + p i/o p int = i dd x v dd watts (chip internal power) p i/o = power dissipation on input and output pins (determined by user) for most applications p i/o < 0.3 x p int . if p i/o is neglected , an approximate relationship between p d and t j is the following: p d = k/(t j + 273 c) (2) solving equations (1) and (2) for k gives: k = p d x (t a + 273 c) + ja x p d 2 (3) where k is a constant pertaining to the particular part. k can be determined from equation (3) by measuring p d (at equilibrium) for a known t a . using this value of k , the values of p d and t j can be obtained by solving equations (1) and (2) iteratively for any value of t a . 1.2.3.1 layout practices each v cc pin should be provided with a low-impedance path to the boards power supply. each ground pin should likewise be provided with a low-impedance path to ground. the power supply pins drive distinct groups of logic on chip. the v cc power supply should be bypassed to ground using at least four 0.1 ? by-pass capacitors located as close as possible to the four sides of the package. the capacitor leads and associated printed circuit traces connecting to chip v cc and ground should be kept to less than half an inch per capacitor lead. a four-layer board is recommended, employing two inner layers as v cc and gnd planes. table 4. thermal characteristics characteristics symbol value unit air flow thermal resistance for tbga ja 13.07 1 1 assumes a single layer board with no thermal vias c/w nc 2 2 natural convection ja 9.55 1 c/w 1 m/s ja 10.48 3 3 assumes a four layer board c/w nc ja 7.78 3 c/w 1 m/s f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
10 MPC8260 (hip3) hardware speci?ations motorola electrical and thermal characteristics all output pins on the MPC8260 have fast rise and fall times. printed circuit (pc) trace interconnection length should be minimized in order to minimize overdamped conditions and re?ctions caused by these fast output switching times. this recommendation particularly applies to the address and data buses. maximum pc trace lengths of six inches are recommended. capacitance calculations should consider all device loads as well as parasitic capacitances due to the pc traces. attention to proper pcb layout and bypassing becomes especially critical in systems with higher capacitive loads because these loads create higher transient currents in the v cc and gnd circuits. pull up all unused inputs or signals that will be inputs during reset. special care should be taken to minimize the noise levels on the pll supply pins. table 5 provides preliminary, estimated power dissipation for various con?urations. note that suitable thermal management is required for conditions above p d = 3w (when the ambient temperature is 70? c or greater) to ensure the junction temperature does not exceed the maximum speci?d value. also note that the i/o power should be included when determining whether to use a heat sink. 1.2.4 ac electrical characteristics the following sections include illustrations and tables of clock diagrams, signals, and cpm outputs and inputs for the 66 mhz MPC8260 device. note that ac timings are based on a 50-p f load. typical output buffer impedances are shown in table 6. table 5. estimated power dissipation for various con?urations 1 1 test temperature = room temperature (25 ? c) bus (mhz) cpm multiplier cpu multiplier cpm (mhz) cpu (mhz) p int (w) 2 2 p int = i dd x v dd watts vddl 2.4 2.5 2.6 2.7 2.8 3 3 2.8 vddl does not apply to hip3 rev c silicon. 33.3 4 4 133.3 133.3 2.04 2.14 2.26 2.38 2.50 50.0 2 3 100 150.0 2.21 2.30 2.45 2.59 2.69 66.7 2 2.5 133.3 166.7 2.47 2.62 2.74 2.88 3.02 66.7 2.5 2.5 166.7 166.7 2.57 2.69 2.83 2.98 3.12 66.7 2 3 133.3 200.0 2.81 2.95 3.12 3.29 3.43 66.7 2.5 3 166.7 200.0 2.88 3.05 3.22 3.38 3.55 50.0 3 4 150 200.0 2.83 3.00 3.14 3.31 3.48 table 6. output buffer impedances 1 1 these are typical values at 65? c. the impedance may vary by ?5% with process and temperature. output buffers typical impedance ( ? ) 60x bus 40 local bus 40 memory controller 40 parallel i/o 46 f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
motorola MPC8260 (hip3) hardware speci?ations 11 electrical and thermal characteristics table 7 lists cpm output characteristics. table 8 lists cpm input characteristics. note that although the speci?ations generally reference the rising edge of the clock, the following ac timing diagrams also apply when the falling edge is the active edge. table 7. ac characteristics for cpm outputs 1 1 output speci?ations are measured from the 50% level of the rising edge of clkin to the 50% level of the signal. timings are measured at the pin. spec number characteristic max delay (ns) min delay (ns) max min 66 mhz 66 mhz sp36a sp37a fcc outputs?nternal clock (nmsi) 6 1 sp36b sp37b fcc outputs?xternal clock (nmsi) 14 2 sp40 sp41 tdm outputs/si 25 5 sp38a sp39a scc/smc/spi/i2c outputs?nternal clock (nmsi) 19 1 sp38b sp39b ex_scc/smc/spi/i2c outputs?xternal clock (nmsi) 19 2 sp42 sp43 pio/timer/idma outputs 14 1 table 8. ac characteristics for cpm inputs 1 1 input speci?ations are measured from the 50% level of the signal to the 50% level of the rising edge of clkin. timings are measured at the pin. spec number characteristic setup (ns) hold (ns) setup hold 66 mhz 66 mhz sp16a sp17a fcc inputs?nternal clock (nmsi) 10 0 sp16b sp17b fcc inputs?xternal clock (nmsi) 3 3 sp20 sp21 tdm inputs/si 15 12 sp18a sp19a scc/smc/spi/i2c inputs?nternal clock (nmsi) 20 0 sp18b sp19b scc/smc/spi/i2c inputs?xternal clock (nmsi) 5 5 sp22 sp23 pio/timer/idma inputs 10 3 f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
12 MPC8260 (hip3) hardware speci?ations motorola electrical and thermal characteristics figure 3 shows the fcc external clock. figure 3. fcc external clock diagram figure 4 shows the fcc internal clock. figure 4. fcc internal clock diagram figure 5 shows the scc/smc/spi/i 2 c external clock. serial clkin fcc input signals fcc output signals fcc output signals note : when gfmr[tci] = 1 note : when gfmr[tci] = 0 sp16b sp17b sp36b/sp37b sp36b/sp37b brg_out fcc input signals fcc output signals fcc output signals note : when gfmr.[tci] = 1 note : when gfmr[tci] = 0 sp36a/sp37a sp36a/sp37a sp17a sp16a f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
motorola MPC8260 (hip3) hardware speci?ations 13 electrical and thermal characteristics figure 5. scc/smc/spi/i 2 c external clock diagram figure 6 shows the scc/smc/spi/i 2 c internal clock. figure 6. scc/smc/spi/i 2 c internal clock diagram figure 7 shows pio, timer, and dma signals. serial clkin scc/smc/spi/i2c input signals scc/smc/spi/i2c output signals sp18b sp19b sp38b/sp39b (see note) (see note) note : there are four possible timing conditions for scc and spi: 1. input sampled on the rising edge and output driven on the rising edge (shown). 2. input sampled on the rising edge and output driven on the falling edge. 3. input sampled on the falling edge and output driven on the falling edge. 4. input sampled on the falling edge and output driven on the rising edge. brg_out scc/smc/spi/i2c input signals scc/smc/spi/i2c output signals sp18a sp19a sp38a/sp39a (see note) (see note) note : there are four possible timing conditions for scc and spi: 1. input sampled on the rising edge and output driven on the rising edge (shown). 2. input sampled on the rising edge and output driven on the falling edge. 3. input sampled on the falling edge and output driven on the falling edge. 4. input sampled on the falling edge and output driven on the rising edge. f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
14 MPC8260 (hip3) hardware speci?ations motorola electrical and thermal characteristics figure 7. pio, timer, and dma signal diagram table 9 lists siu input characteristics. table 9. ac characteristics for siu inputs 1 1 input speci?ations are measured from the 50% level of the signal to the 50% level of the rising edge of clkin. timings are measured at the pin. spec number characteristic setup (ns) hold (ns) setup hold 66 mhz 66 mhz sp11 sp10 aa ck /ar tr y /t a /ts /tea /dbg /bg /br 61 sp12 sp10 data bus in normal mode 5 1 sp13 sp10 data bus in ecc and parity modes 8 1 sp14 sp10 dp pins 8 1 sp14 sp10 all other pins 5 1 sys clk pio/idma/timer[tgate assertion] input signals idma output signals sp22 sp23 sp42/sp43 timer/pio output signals sp42/sp43 timer input signal [tgate deassertion] sp22 sp23 note : tgate is asserted on the rising edge of the clock; it is deasserted on the falling edge. (see note) (see note) f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
motorola MPC8260 (hip3) hardware speci?ations 15 electrical and thermal characteristics table 10 lists siu output characteristics. activating data pipelining (setting br x [dr] in the memory controller) improves the ac timing. when data pipelining is activated, sp12 can be used for data bus setup even when ecc or parity are used. also, sp33a can be used as the ac speci?ation for dp signals. figure 8 shows tdm input and output signals. figure 8. tdm signal diagram figure 9 shows the interaction of several bus signals. table 10. ac characteristics for siu outputs 1 1 output speci?ations are measured from the 50% level of the rising edge of clkin to the 50% level of the signal. timings are measured at the pin. spec number characteristic max delay (ns) min delay (ns) max min 66 mhz 66 mhz sp31 sp30 psd v al /tea /t a 10 0.5 sp32 sp30 add/add_atr./baddr/ci/gbl/wt 8 0.5 sp33a sp30 data bus 8 0.5 sp33b sp30 dp 12 0.5 sp34 sp30 memc signals/ale 6 0.5 sp35 sp30 all other signals 7.5 0.5 serial clkin tdm input signals tdm output signals sp20 sp21 sp40/sp41 note : there are four possible tdm timing conditions: 1. input sampled on the rising edge and output driven on the rising edge (shown). 2. input sampled on the rising edge and output driven on the falling edge. 3. input sampled on the falling edge and output driven on the falling edge. 4. input sampled on the falling edge and output driven on the rising edge. f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
16 MPC8260 (hip3) hardware speci?ations motorola electrical and thermal characteristics figure 9. bus signals figure 10 shows signal behavior for all parity modes (including ecc, rmw parity, and standard parity). figure 10. parity mode diagram figure 11 shows signal behavior in memc mode. clkin aack /artry /ta /ts /tea / data bus normal mode all other input signals psd v al /tea /ta output signals add/add_atr/baddr/ci/ data bus output signals all other output signals sp11 sp12 sp15 sp10 sp10 sp10 sp30 sp30 sp30 sp30 sp32 sp33a sp35 dbg /bg /br input signals gbl/wt output signals sp31 input signal clkin data bus, ecc, and parity mode input signals dp mode input signal dp mode output signal sp13 sp10 sp14 sp10 sp33b/sp30 f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
motorola MPC8260 (hip3) hardware speci?ations 17 electrical and thermal characteristics figure 11. memc mode diagram note generally, all MPC8260 bus and system output signals are driven from the rising edge of the input clock (clkin). memory controller signals, however, trigger on four points within a clkin cycle. each cycle is divided by four internal ticks: t1, t2, t3, and t4. t1 always occurs at the rising edge, and t3 at the falling edge, of clkin. however, the spacing of t2 and t4 depends on the pll clock ratio selected, as shown in table 11. figure 12 is a graphical representation of table 11. figure 12. internal tick spacing for memory controller signals note the upm machine outputs change on the internal tick determined by the memory controller programming; the ac speci?ations are relative to the internal tick. note that sdram and gpcm machine outputs change on clkins rising edge. table 11. tick spacing for memory controller signals pll clock ratio tick spacing (t1 occurs at the rising edge of clkin) t2 t3 t4 1:2, 1:3, 1:4, 1:5, 1:6 1/4 clkin 1/2 clkin 3/4 clkin 1:2.5 3/10 clkin 1/2 clkin 8/10 clkin 1:3.5 4/14 clkin 1/2 clkin 11/14 clkin clkin v_clk memory controller signals sp34/sp30 clkin t1 t2 t3 t4 clkin t1 t2 t3 t4 for 1:2.5 for 1:3.5 clkin t1 t2 t3 t4 for 1:2, 1:3, 1:4, 1:5, 1:6 f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
18 MPC8260 (hip3) hardware speci?ations motorola clock con?uration modes 1.3 clock con?uration modes to con?ure the main pll multiplication factor and the core, cpm, and 60x bus frequencies, the modck[1?] pins are sampled while hreset is asserted. table 12 shows the eight basic con?uration modes. another 49 modes are available by using the con?uration pin (rstconf ) and driving four pins on the data bus. note clock con?urations change only after por is asserted. 1.3.1 local bus mode table 12 describes default clock modes for the MPC8260. table 13 describes all possible clock con?urations when using the hard reset con?uration sequence. note also that basic modes are shown in boldface type. table 12. clock default modes modck[1?] input clock frequency cpm multiplication factor cpm frequency core multiplication factor core frequency 000 33 mhz 3 100 mhz 4 133 mhz 001 33 mhz 3 100 mhz 5 166 mhz 010 33 mhz 4 133 mhz 4 133 mhz 011 33 mhz 4 133 mhz 5 166 mhz 100 66 mhz 2 133 mhz 2.5 166 mhz 101 66 mhz 2 133 mhz 3 200 mhz 110 66 mhz 2.5 166 mhz 2.5 166 mhz 111 66 mhz 2.5 166 mhz 3 200 mhz table 13. clock configuration modes 1 modck_h?odck[1?] input clock frequency 2,3,4 cpm multiplication factor 2, 5 cpm frequency 2 core multiplication factor 2, 6 core frequency 2 0001_000 33 mhz 2 66 mhz 4 133 mhz 0001_001 33 mhz 2 66 mhz 5 166 mhz 0001_010 33 mhz 2 66 mhz 6 200 mhz 0001_011 33 mhz 2 66 mhz 7 233 mhz 0001_100 33 mhz 2 66 mhz 8 266 mhz 0001_101 33 mhz 3 100 mhz 4 133 mhz 0001_110 33 mhz 3 100 mhz 5 166 mhz 0001_111 33 mhz 3 100 mhz 6 200 mhz 0010_000 33 mhz 3 100 mhz 7 233 mhz 0010_001 33 mhz 3 100 mhz 8 266 mhz f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
motorola MPC8260 (hip3) hardware speci?ations 19 clock con?uration modes 0010_010 33 mhz 4 133 mhz 4 133 mhz 0010_011 33 mhz 4 133 mhz 5 166 mhz 0010_100 33 mhz 4 133 mhz 6 200 mhz 0010_101 33 mhz 4 133 mhz 7 233 mhz 0010_110 33 mhz 4 133 mhz 8 266 mhz 0010_111 33 mhz 5 166 mhz 4 133 mhz 0011_000 33 mhz 5 166 mhz 5 166 mhz 0011_001 33 mhz 5 166 mhz 6 200 mhz 0011_010 33 mhz 5 166 mhz 7 233 mhz 0011_011 33 mhz 5 166 mhz 8 266 mhz 0011_100 33 mhz 6 200 mhz 4 133 mhz 0011_101 33 mhz 6 200 mhz 5 166 mhz 0011_110 33 mhz 6 200 mhz 6 200 mhz 0011_111 33 mhz 6 200 mhz 7 233 mhz 0100_000 33 mhz 6 200 mhz 8 266 mhz 0100_001 reserved 0100_010 0100_011 0100_100 0100_101 0100_110 0100_111 reserved 0101_000 0101_001 0101_010 0101_011 0101_100 0101_101 66 mhz 2 133 mhz 2 133 mhz 0101_110 66 mhz 2 133 mhz 2.5 166 mhz 0101_111 66 mhz 2 133 mhz 3 200 mhz 0110_000 66 mhz 2 133 mhz 3.5 233 mhz table 13. clock configuration modes 1 (continued) modck_h?odck[1?] input clock frequency 2,3,4 cpm multiplication factor 2, 5 cpm frequency 2 core multiplication factor 2, 6 core frequency 2 f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
20 MPC8260 (hip3) hardware speci?ations motorola pinout 1.4 pinout this section provides the pin assignments and pinout list for the MPC8260. 1.4.1 pin assignments figure 13 shows the pinout of the MPC8260 480 tbga package as viewed from the top surface. 0110_001 66 mhz 2 133 mhz 4 266 mhz 0110_010 66 mhz 2 133 mhz 4.5 300 mhz 0110_011 66 mhz 2.5 166 mhz 2 133 mhz 0110_100 66 mhz 2.5 166 mhz 2.5 166 mhz 0110_101 66 mhz 2.5 166 mhz 3 200 mhz 0110_110 66 mhz 2.5 166 mhz 3.5 233 mhz 0110_111 66 mhz 2.5 166 mhz 4 266 mhz 0111_000 66 mhz 2.5 166 mhz 4.5 300 mhz 0111_001 66 mhz 3 200 mhz 2 133 mhz 0111_010 66 mhz 3 200 mhz 2.5 166 mhz 0111_011 66 mhz 3 200 mhz 3 200 mhz 0111_100 66 mhz 3 200 mhz 3.5 233 mhz 0111_101 66 mhz 3 200 mhz 4 266 mhz 0111_110 66 mhz 3 200 mhz 4.5 300 mhz 0111_111 66 mhz 3.5 233 mhz 2 133 mhz 1000_000 66 mhz 3.5 233 mhz 2.5 166 mhz 1000_001 66 mhz 3.5 233 mhz 3 200 mhz 1000_010 66 mhz 3.5 233 mhz 3.5 233 mhz 1000_011 66 mhz 3.5 233 mhz 4 266 mhz 1000_100 66 mhz 3.5 233 mhz 4.5 300 mhz 1 because of speed dependencies, not all of the possible con?urations in table 13 are applicable. 2 the user should choose the input clock frequency and the multiplication factors such that the frequency of the cpu ranges between 133?00 and the cpm ranges between 50?66 mhz. 3 input clock frequency is given only for the purpose of reference. user should set modck_h?odck_l so that the resulting con?uration does not exceed the frequency rating of the users part. 4 60x and local bus frequency. identical to clkin. 5 cpm multiplication factor = cpm clock/bus clock 6 cpu multiplication factor = core pll multiplication factor table 13. clock configuration modes 1 (continued) modck_h?odck[1?] input clock frequency 2,3,4 cpm multiplication factor 2, 5 cpm frequency 2 core multiplication factor 2, 6 core frequency 2 f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
motorola MPC8260 (hip3) hardware speci?ations 21 pinout figure 13. pinout of the 480 tbga package as viewed from the top surface figure 14 shows the side pro?e of the tbga package to indicate the direction of the top surface view. figure 14. side view of the tbga package 1 2 3 4 5 6 7 8 910111213141516 17 18 19 20 21 22 23 24 25 26 27 28 29 not to scale 1 2 3 4 5 6 7 8 9 10111213 141516171819202122 2324 2526272829 a b c d e f g h j k l m n p r t u v w y aa ab ac ad ae af ag ah aj a b c d e f g h j k l m n p r t u v w y aa ab ac ad ae af ag ah aj soldermask copper traces die copper heat spreader (oxidized for insulation) 1.27 mm pitch glob-top dam etched pressure sensitive die glob-top filled area polymide tape cavity adhesive attach view f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
22 MPC8260 (hip3) hardware speci?ations motorola pinout table 14 shows the pinout list of the MPC8260. table 15 de?es conventions and acronyms used in table 14. table 14. pinout list pin name ball br w5 bg f4 abb /irq2 e2 ts e3 a0 g1 a1 h5 a2 h2 a3 h1 a4 j5 a5 j4 a6 j3 a7 j2 a8 j1 a9 k4 a10 k3 a11 k2 a12 k1 a13 l5 a14 l4 a15 l3 a16 l2 a17 l1 a18 m5 a19 n5 a20 n4 a21 n3 a22 n2 a23 n1 a24 p4 a25 p3 a26 p2 a27 p1 a28 r1 f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
motorola MPC8260 (hip3) hardware speci?ations 23 pinout a29 r3 a30 r5 a31 r4 tt0 f1 tt1 g4 tt2 g3 tt3 g2 tt4 f2 tbst d3 tsiz0 c1 tsiz1 e4 tsiz2 d2 tsiz3 f5 aa ck f3 ar tr y e1 dbg v1 dbb /irq3 v2 d0 b20 d1 a18 d2 a16 d3 a13 d4 e12 d5 d9 d6 a6 d7 b5 d8 a20 d9 e17 d10 b15 d11 b13 d12 a11 d13 e9 d14 b7 d15 b4 d16 d19 d17 d17 table 14. pinout list (continued) pin name ball f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
24 MPC8260 (hip3) hardware speci?ations motorola pinout d18 d15 d19 c13 d20 b11 d21 a8 d22 a5 d23 c5 d24 c19 d25 c17 d26 c15 d27 d13 d28 c11 d29 b8 d30 a4 d31 e6 d32 e18 d33 b17 d34 a15 d35 a12 d36 d11 d37 c8 d38 e7 d39 a3 d40 d18 d41 a17 d42 a14 d43 b12 d44 a10 d45 d8 d46 b6 d47 c4 d48 c18 d49 e16 d50 b14 d51 c12 d52 b10 table 14. pinout list (continued) pin name ball f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
motorola MPC8260 (hip3) hardware speci?ations 25 pinout d53 a7 d54 c6 d55 d5 d56 b18 d57 b16 d58 e14 d59 d12 d60 c10 d61 e8 d62 d6 d63 c2 dp0/rsr v /ext_br2 b22 irq1 /dp1/ext_bg2 a22 irq2 /dp2/tlbisync /ext_dbg2 e21 irq3 /dp3/ckstp_out /ext_br3 d21 irq4 /dp4/core_sreset /ext_bg3 c21 irq5 /dp5/tben /ext_dbg3 b21 irq6 /dp6/cse0 a21 irq7 /dp7/cse1 e20 psd v al v3 t a c22 tea v5 gbl /irq1 w1 ci /baddr29/irq2 u2 wt /baddr30/irq3 u3 l2_hit /irq4 y4 cpu_bg /baddr31/irq5 u4 cpu_dbg r2 cpu_br y3 cs0 f25 cs1 c29 cs2 e27 cs3 e28 cs4 f26 cs5 f27 table 14. pinout list (continued) pin name ball f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
26 MPC8260 (hip3) hardware speci?ations motorola pinout cs6 f28 cs7 g25 cs8 d29 cs9 e29 cs10 /bctl1 f29 cs11 /ap0 g28 baddr27 t5 baddr28 u1 ale t2 bctl0 a27 pwe0 /psddqm0 /pbs0 c25 pwe1 /psddqm1 /pbs1 e24 pwe2 /psddqm2 /pbs2 d24 pwe3 /psddqm3 /pbs3 c24 pwe4 /psddqm4 /pbs4 b26 pwe5 /psddqm5 /pbs5 a26 pwe6 /psddqm6 /pbs6 b25 pwe7 /psddqm7 /pbs7 a25 psda10/pgpl0 e23 psd we /pgpl1 b24 poe /psdras /pgpl2 a24 psdcas /pgpl3 b23 pgt a /pupmwait/pgpl4/ppbs a23 psdamux/pgpl5 d22 l we0 /lsddqm0 /lbs0 h28 l we1 /lsddqm1 /lbs1 h27 l we2 /lsddqm2 /lbs2 h26 l we3 /lsddqm3 /lbs3 g29 lsda10/lgpl0 d27 lsd we /lgpl1 c28 loe /lsdras /lgpl2 e26 lsdcas /lgpl3 d25 lgt a /lupmwait/lgpl4/lpbs c26 lgpl5/lsdamux 1 b27 l wr d28 table 14. pinout list (continued) pin name ball f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
motorola MPC8260 (hip3) hardware speci?ations 27 pinout l_a14 n27 l_a15/smi t29 l_a16 r27 l_a17/ckstp_out r26 l_a18 r29 l_a19 r28 l_a20 w29 l_a21 p28 l_a22 n26 l_a23 aa27 l_a24 p29 l_a25 aa26 l_a26 n25 l_a27 aa25 l_a28/core_sreset ab29 l_a29 ab28 l_a30 p25 l_a31 ab27 lcl_d0 h29 lcl_d1 j29 lcl_d2 j28 lcl_d3 j27 lcl_d4 j26 lcl_d5 j25 lcl_d6 k25 lcl_d7 l29 lcl_d8 l27 lcl_d9 l26 lcl_d10 l25 lcl_d11 m29 lcl_d12 m28 lcl_d13 m27 lcl_d14 m26 lcl_d15 n29 lcl_d16 t25 table 14. pinout list (continued) pin name ball f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
28 MPC8260 (hip3) hardware speci?ations motorola pinout lcl_d17 u27 lcl_d18 u26 lcl_d19 u25 lcl_d20 v29 lcl_d21 v28 lcl_d22 v27 lcl_d23 v26 lcl_d24 w27 lcl_d25 w26 lcl_d26 w25 lcl_d27 y29 lcl_d28 y28 lcl_d29 y25 lcl_d30 aa29 lcl_d31 aa28 lcl_dp0 l28 lcl_dp1 n28 lcl_dp2 t28 lcl_dp3 w28 irq0 /nmi_out t1 irq7 /int_out /ape d1 trst ah3 tck ag5 tms aj3 tdi ae6 tdo af5 tris ab4 poreset ag6 hreset ah5 sreset af6 qreq aa3 rstconf aj4 modck1/ap1/tc0/bnksel0 w2 modck2/ap2/tc1/bnksel1 w3 modck3/ap3/tc2/bnksel2 w4 table 14. pinout list (continued) pin name ball f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
motorola MPC8260 (hip3) hardware speci?ations 29 pinout xfc ab2 clkin1 ah4 pa0/rest ar t1 /dreq3/fcc2_utm_txaddr2 ac29 2 pa1/reject1 /fcc2_utm_txaddr1/done3 ac25 2 pa2/clk20/fcc2_utm_txaddr0/d a ck3 ae28 2 pa3/clk19/fcc2_utm_rxaddr0/d a ck4 /l1rxd1a2 ag29 2 pa4/reject2 /fcc2_utm_rxaddr1/done4 ag28 2 pa5/rest ar t2 /dreq4/fcc2_utm_rxaddr2 ag26 2 pa6/l1rsynca1 ae24 2 pa7/smsyn2/l1tsynca1/l1gnta1 ah25 2 pa8/smrxd2/l1rxd0a1/l1rxda1 af23 2 pa9/smtxd2/l1txd0a1 ah23 2 pa10/fcc1_ut8_rxd0/fcc1_ut16_rxd8/msnum5 ae22 2 pa11/fcc1_ut8_rxd1/fcc1_ut16_rxd9/msnum4 ah22 2 pa12/fcc1_ut8_rxd2/fcc1_ut16_rxd10/msnum3 aj21 2 pa13/fcc1_ut8_rxd3/fcc1_ut16_rxd11/msnum2 ah20 2 pa14/fcc1_ut8_rxd4/fcc1_ut16_rxd12/fcc1_rxd3 ag19 2 pa15/fcc1_ut8_rxd5/fcc1_ut16_rxd13/fcc1_rxd2 af18 2 pa16/fcc1_ut8_rxd6/fcc1_ut16_rxd14/fcc1_rxd1 af17 2 pa17/fcc1_ut8_rxd7/fcc1_ut16_rxd15/fcc1_rxd0/fcc1_rxd ae16 2 pa18/fcc1_ut8_txd7/fcc1_ut16_txd15/fcc1_txd0/fcc1_txd aj16 2 pa19/fcc1_ut8_txd6/fcc1_ut16_txd14/fcc1_txd1 ag15 2 pa20/fcc1_ut8_txd5/fcc1_ut16_txd13/fcc1_txd2 aj13 2 pa21/fcc1_ut8_txd4/fcc1_ut16_txd12/fcc1_txd3 ae13 2 pa22/fcc1_ut8_txd3/fcc1_ut16_txd11 af12 2 pa23/fcc1_ut8_txd2/fcc1_ut16_txd10 ag11 2 pa24/fcc1_ut8_txd1/fcc1_ut16_txd9/msnum1 ah9 2 pa25/fcc1_ut8_txd0/fcc1_ut16_txd8/msnum0 aj8 2 pa26/fcc1_utm_rxclav/fcc1_uts_rxclav/fcc1_mii_rx_er ah7 2 pa27/fcc1_ut_rxsoc/fcc1_mii_rx_dv af7 2 pa28/fcc1_utm_rxenb /fcc1_uts_rxenb /fcc1_mii_tx_en ad5 2 pa29/fcc1_ut_txsoc/fcc1_mii_tx_er af1 2 pa30/fcc1_utm_txclav/fcc1_uts_txclav/fcc1_mii_crs/fcc1_r ts ad3 2 pa31/fcc1_utm_txenb /fcc1_uts_txenb /fcc1_mii_col ab5 2 pb4/fcc3_txd3/fcc2_ut8_rxd0/l1rsynca2/fcc3_r ts ad28 2 table 14. pinout list (continued) pin name ball f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
30 MPC8260 (hip3) hardware speci?ations motorola pinout pb5/fcc3_txd2/fcc2_ut8_rxd1/l1tsynca2/l1gnta2 ad26 2 pb6/fcc3_txd1/fcc2_ut8_rxd2/l1rxda2/l1rxd0a2 ad25 2 pb7/fcc3_txd0/fcc3_txd/fcc2_ut8_rxd3/l1txda2/l1txd0a2 ae26 2 pb8/fcc2_ut8_txd3/fcc3_rxd0/fcc3_rxd/txd3/l1rsyncd1 ah27 2 pb9/fcc2_ut8_txd2/fcc3_rxd1/l1txd2a2/l1tsyncd1/l1gntd1 ag24 2 pb10/fcc2_ut8_txd1/fcc3_rxd2/l1rxdd1 ah24 2 pb11/fcc3_rxd3/fcc2_ut8_txd0/l1txdd1 aj24 2 pb12/fcc3_mii_crs/l1clkob1/l1rsyncc1/txd2 ag22 2 pb13/fcc3_mii_col/l1rqb1 /l1tsyncc1/l1gntc1/l1txd1a2 ah21 2 pb14/fcc3_mii_tx_en/rxd3/l1rxdc1 ag20 2 pb15/fcc3_mii_tx_er/rxd2/l1txdc1 af19 2 pb16/fcc3_mii_rx_er/l1clkoa1/clk18 aj18 2 pb17/fcc3_mii_rx_dv/l1rqa1/clk17 aj17 2 pb18/fcc2_ut8_rxd4/fcc2_rxd3/l1clkod2/l1rxd2a2 ae14 2 pb19/fcc2_ut8_rxd5/fcc2_rxd2/l1rqd2/l1rxd3a2 af13 2 pb20/fcc2_ut8_rxd6/fcc2_rxd1/l1rsyncd2/l1txd1a1 ag12 2 pb21/fcc2_ut8_rxd7/fcc2_rxd0/fcc2_rxd/l1tsyncd2/l1gntd2/ l1txd2a1 ah11 2 pb22/fcc2_ut8_txd7/fcc2_txd0/fcc2_txd/l1rxd1a1/l1rxdd2 ah16 2 pb23/fcc2_ut8_txd6/fcc2_txd1/l1rxd2a1/l1txdd2 ae15 2 pb24/fcc2_ut8_txd5/fcc2_txd2/l1rxd3a1/l1rsyncc2 aj9 2 pb25/fcc2_ut8_txd4/fcc2_txd3/l1tsyncc2/l1gntc2/l1txd3a1 ae9 2 pb26/fcc2_mii_crs/fcc2_ut8_txd1/l1rxdc2 aj7 2 pb27/fcc2_mii_col/fcc2_ut8_txd0/l1txdc2 ah6 2 pb28/fcc2_mii_rx_er/fcc2_r ts /l1tsyncb2/l1gntb2/txd1 ae3 2 pb29/fcc2_utm_rxclav/fcc2_uts_rxclav/l1rsyncb2/ fcc2_mii_tx_en ae2 2 pb30/fcc2_mii_rx_dv/fcc2_ut_txsoc/l1rxdb2 ac5 2 pb31/fcc2_mii_tx_er/fcc2_ut_rxsoc/l1txdb2 ac4 2 pc0/dreq1/brgo7/smsyn2 /l1clkoa2 ab26 2 pc1/dreq2/brgo6/l1rqa2 ad29 2 pc2/fcc3_cd /fcc2_ut8_txd3/done2 ae29 2 pc3/fcc3_cts /fcc2_ut8_txd2/d a ck2 /cts4 ae27 2 pc4/fcc2_utm_rxenb /fcc2_uts_rxenb /si2_l1st4/fcc2_cd af27 2 pc5/fcc2_utm_txclav/fcc2_uts_txclav/si2_l1st3/fcc2_cts af24 2 pc6/fcc1_cd /l1clkoc1/fcc1_utm_rxaddr2/fcc1_uts_rxaddr2/ fcc1_utm_rxclav1 aj26 2 table 14. pinout list (continued) pin name ball f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
motorola MPC8260 (hip3) hardware speci?ations 31 pinout pc7/fcc1_cts /l1rqc1 /fcc1_utm_txaddr2/fcc1_uts_txaddr2/ fcc1_utm_txclav1 aj25 2 pc8/cd4 /rena4/fcc1_ut16_txd0/si2_l1st2/cts3 af22 2 pc9/cts4 /clsn4/fcc1_ut16_txd1/si2_l1st1/l1tsynca2/l1gnta2 ae21 2 pc10/cd3 /rena3/fcc1_ut16_txd2/si1_l1st4/fcc2_ut8_rxd3 af20 2 pc11/cts3 /clsn3/l1clkod1/l1txd3a2/fcc2_ut8_rxd2 ae19 2 pc12/cd2 /rena2/si1_l1st3/fcc1_utm_rxaddr1/fcc1_uts_rxaddr1 ae18 2 pc13/cts2 /clsn2/l1rqd1 /fcc1_utm_txaddr1/fcc1_uts_txaddr1 ah18 2 pc14/cd1 /rena1/fcc1_utm_rxaddr0/fcc1_uts_rxaddr0 ah17 2 pc15/cts1 /clsn1/smtxd2/fcc1_utm_txaddr0/fcc1_uts_txaddr0 ag16 2 pc16/clk16/tin4 af15 2 pc17/clk15/tin3/brgo8 aj15 2 pc18/clk14/tga te2 ah14 2 pc19/clk13/brgo7/spiclk ag13 2 pc20/clk12/tga te1 ah12 2 pc21/clk11/brgo6 aj11 2 pc22/clk10/done1 ag10 2 pc23/clk9/brgo5/d a ck1 ae10 2 pc24/fcc2_ut8_txd3/clk8/t out4 af9 2 pc25/fcc2_ut8_txd2/clk7/brgo4 ae8 2 pc26/clk6/t out3 /tmclk aj6 2 pc27/fcc3_txd/fcc3_txd0/clk5/brgo3 ag2 2 pc28/clk4/tin1/t out2 /cts2 /clsn2 af3 2 pc29/clk3/tin2/brgo2/cts1 /clsn1 af2 2 pc30/fcc2_ut8_txd3/clk2/t out1 ae1 2 pc31/clk1/brgo1 ad1 2 pd4/brgo8/l1tsyncd1/l1gntd1/fcc3_r ts /smrxd2 ac28 2 pd5/fcc1_ut16_txd3/done1 ad27 2 pd6/fcc1_ut16_txd4/d a ck1 af29 2 pd7/smsyn1/fcc1_utm_txaddr3/fcc1_uts_txaddr3/ fcc1_utm_txaddr4/fcc1_txclav2 af28 2 pd8/smrxd1/fcc2_ut_txprty/brgo5 ag25 2 pd9/smtxd1/fcc2_ut_rxprty/brgo3 ah26 2 pd10/l1clkob2/fcc2_ut8_rxd1/l1rsyncb1/brgo4 aj27 2 pd11/l1rqb2 /fcc2_ut8_rxd0/l1tsyncb1/l1gntb1 aj23 2 pd12/si1_l1st2/l1rxdb1 ag23 2 table 14. pinout list (continued) pin name ball f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
32 MPC8260 (hip3) hardware speci?ations motorola pinout pd13/si1_l1st1/l1txdb1 aj22 2 pd14/fcc1_ut16_rxd0/l1clkoc2/i2cscl ae20 2 pd15/fcc1_ut16_rxd1/l1rqc2 /i2csda aj20 2 pd16/fcc1_ut_txprty/l1tsyncc1/l1gntc1/spimiso ag18 2 pd17/fcc1_ut_rxprty/brgo2/spimosi ag17 2 pd18/fcc1_utm_rxaddr4/fcc1_uts_rxaddr4/fcc1_utm_rxclav3/ spiclk/fcc2_utm_rxaddr3/fcc2_uts_rxaddr0 af16 2 pd19/fcc1_utm_txaddr4/fcc1_uts_txaddr4/fcc1_utm_txclav3/ spisel/brgo1/fcc2_utm_txaddr3/fcc2_uts_txaddr0 ah15 2 pd20/r ts4 /tena4/fcc1_ut16_rxd2/l1rsynca2 aj14 2 pd21/txd4/fcc1_ut16_rxd3/l1rxd0a2/l1rxda2 ah13 2 pd22/rxd4/fcc1_ut16_txd5/l1txd0a2/l1txda2 aj12 2 pd23/r ts3 /tena3/fcc1_ut16_rxd4/l1rsyncd1 ae12 2 pd24/txd3/fcc1_ut16_rxd5/l1rxdd1 af10 2 pd25/rxd3/fcc1_ut16_txd6/l1txdd1 ag9 2 pd26/r ts2 /tena2/fcc1_ut16_rxd6/l1rsyncc1 ah8 2 pd27/txd2/fcc1_ut16_rxd7/l1rxdc1 ag7 2 pd28/rxd2/fcc1_ut16_txd7/l1txdc1 ae4 2 pd29/r ts1 /tena1/fcc1_utm_rxaddr3/fcc1_uts_rxaddr3/ fcc1_utm_rxclav2/fcc2_utm_rxaddr4/fcc2_uts_rxaddr1 ag1 2 pd30/fcc2_utm_txenb /fcc2_uts_txenb /txd1 ad4 2 pd31/rxd1 ad2 2 vccsyn ab3 vccsyn1 b9 gndsyn ab1 spare1 3 ae11 spare4 3 u5 spare5 4 af25 spare6 3 v4 thermal0 5 aa1 thermal1 5 ag4 i/o power ag21, ag14, ag8, aj1, aj2, ah1, ah2, ag3, af4, ae5, ac27, y27, t27, p27, k26, g27, ae25, af26, ag27, ah28, ah29, aj28, aj29, c7, c14, c16, c20, c23, e10, a28, a29, b28, b29, c27, d26, e25, h3, m4, t3, aa4, a1, a2, b1, b2, c3, d4, e5 table 14. pinout list (continued) pin name ball f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
motorola MPC8260 (hip3) hardware speci?ations 33 package description symbols used in table 14 are described in table 15. 1.5 package description the following sections provide the package parameters and mechanical dimensions for the MPC8260. 1.5.1 package parameters package parameters are provided in table 16. the package type is a 37.5 x 37.5 mm, 480-lead tbga. core power u28, u29, k28, k29, a9, a19, b19, m1, m2, y1, y2, ac1, ac2, ah19, aj19, ah10, aj10, aj5 ground aa5, af21, af14, af8, ae7, af11, ae17, ae23, ac26, ab25, y26, v25, t26, r25, p26, m25, k27, h25, g26, d7, d10, d14, d16, d20, d23, c9, e11, e13, e15, e19, e22, b3, g5, h4, k5, m3, p5, t4, y5, aa2, ac3 1 only on rev c.2 silicon. 2 the default con?uration of the cpm pins (pa[0?1], pb[4?1], pc[0?1], pd[4?1]) is input. to prevent excessive dc current, it is recommended to either pull unused pins to gnd or vddh, or to con?ure them as outputs. 3 must be pulled down or left ?ating. 4 must be pulled down or left ?ating. however, if compatibility with hip4 silicon is required, this pin must be pulled up or left ?ating. 5 for information on how to use this pin, refer to MPC8260 powerquicc ii thermal resistor guide available at www.motorola.com/semiconductors. table 15. symbol legend symbol meaning o verbar signals with overbars, such as t a , are active low. utm indicates that a signal is part of the utopia master interface. uts indicates that a signal is part of the utopia slave interface. ut8 indicates that a signal is part of the 8-bit utopia interface. ut16 indicates that a signal is part of the 16-bit utopia interface. mii indicates that a signal is part of the media independent interface. table 16. package parameters parameter value package outline 37.5 x 37.5 mm interconnects 480 (29 x 29 ball array) pitch 1.27 mm nominal unmounted package height 1.55 mm table 14. pinout list (continued) pin name ball f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
34 MPC8260 (hip3) hardware speci?ations motorola ordering information 1.5.2 mechanical dimensions figure 15 provides the mechanical dimensions and bottom surface nomenclature of the 480 tbga package. figure 15. mechanical dimensions and bottom surface nomenclature 1.6 ordering information figure 16 provides an example of the motorola part numbering nomenclature for the MPC8260. in addition to the processor frequency, the part numbering scheme also consists of a part modi?r that indicates any enhancement(s) in the part from the original production design. each part number also contains a revision code that refers to the die mask revision number and is speci?d in the part numbering scheme for identi?ation purposes only. for more information, contact your local motorola sales of?e. dim millimeters min max a 1.45 1.65 a1 0.60 0.70 a2 0.85 0.95 a3 0.25 b 0.65 0.85 d 37.50 bsc d1 35.56 ref e 1.27 bsc e 37.50 bsc e1 35.56 ref notes: 1. dimensions and tolerancing per asme y14.5m-1994. 2. dimensions in millimeters. 3. dimension b is measured at the maximum solder ball diameter, parallel to primary data a. 4. primary data a and the seating plane are de?ed by the spherical crowns of the solder balls. f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
motorola MPC8260 (hip3) hardware speci?ations 35 document revision history figure 16. motorola part number key 1.7 document revision history table 17 lists signi?ant changes in each revision of this document. table 17. document revision history revision date substantive changes 0 initial version 0.1 1/2000 0.2?.5 temporary revisions 0.6 5/2001 corrected the thermal values in table 3, ?hermal characteristics. 0.7 11/2001 revision of table 5, ?ower dissipation modi?ations to figure 9, table 2,table 10, table 11 additional revisions to text and ?ures throughout 0.8 2/2002 table 7, table 8, table 9, and table 10: revision 0.7 of this document incorrectly included values for 83 mhz. 83 mhz is not supported on the MPC8260. table 14: notes added to pins at ae11, af25, u5, and v4. 0.9 2/2002 table 14: additional note added to ae11 1.0 3/2002 table 14: modi?d notes to pins ae11 and af25. table 14: added note to pins aa1 and ag4 (therm0 and therm1). 1.1 5/2002 section 1.1, ?eatures? updated minimum supported core frequency to 133 mhz addition of ?ote at bottom of page 5. table 13: note 3. product code device number package (zu = 480 tbga) core voltage processor frequency die revision level mpc 82xx c zu xxx (cpu/cpm/bus) x (nn = major.minor) xx temperature range blank = 0 to 105 ?c c = -40 to 105 ?c f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
36 MPC8260 (hip3) hardware speci?ations motorola document revision history 1.2 8/2003 note : in revision 0.7, sp30 (table 10) was changed. this change was not previously recorded in this ?ocument revision history table. addition of mpc8255 description to section 1.1, ?eatures addition of figure 2 addition of vccsyn to ?ote: core, pll, and i/o supply voltages following table 2 addition of note 1 to table 3 addition of notes or modi?ations to figure 3 through figure 8 addition of reference notes 4, 5, and 6 to table 13 addition of note 2 to table 14 addition of spiclk to pc19 in table 14. it is documented correctly in the MPC8260 powerquicc ii family reference manual but had previously been omitted from table 14. table 17. document revision history revision date substantive changes f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
motorola MPC8260 (hip3) hardware speci?ations 37 document revision history this page intentionally left blank f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
38 MPC8260 (hip3) hardware speci?ations motorola document revision history this page intentionally left blank f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
motorola MPC8260 (hip3) hardware speci?ations 39 document revision history this page intentionally left blank f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .
mpc82ec/d how to reach us: usa/europe/locations not listed: motorola literature distribution; p.o. box 5405, denver, colorado 80217 1-303-675-2140 or 1-800-441-2447 japan: motorola japan ltd.; sps, technical information center, 3-20-1, minami-azabu minato-ku, tokyo 106-8573 japan 81-3-3440-3569 asia/pacific: motorola semiconductors h.k. ltd.; silicon harbour centre, 2 dai king street, tai po industrial estate, tai po, n.t., hong kong 852-26668334 technical information center: 1-800-521-6274 home page: http://www.motorola.com/semiconductors document comments: fax (512) 933-2625, attn: risc applications engineering information in this document is provided solely to enable system and software implementers to use motorola products. there are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. motorola reserves the right to make changes without further notice to any products herein. motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does motorola assume any liability arising out of the application or use of any product or circuit, and speci?ally disclaims any and all liability, including without limitation consequential or incidental damages. ?ypical parameters which may be provided in motorola data sheets and/or speci?ations can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?ypicals must be validated for each customer application by customers technical experts. motorola does not convey any license under its patent rights nor the rights of others. motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the motorola product could create a situation where personal injury or death may occur. should buyer purchase or use motorola products for any such unintended or unauthorized application, buyer shall indemnify and hold motorola and its of?ers, employees, subsidiaries, af?iates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that motorola was negligent regarding the design or manufacture of the part. motorola and the stylized m logo are registered in the u.s. patent and trademark of?e. digital dna is a trademark of motorola, inc. all other product or service names are the property of their respective owners. motorola, inc. is an equal opportunity/af?mative action employer. ?motorola, inc. 2003 f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . .

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